BOND Dewax Solution
1 L AR9222 P
Components
BOND Dewax Solution is a deparaffinization solution specifically designed
for use on the automated BOND system. It is provided ready-to-use in 1 L
bottles ａnd can be poured directly into the appropriate bulk reagent
container on the instrument.
Background
The use of BOND Dewax Solution allows paraffin wax to be removed from
tissue sections before rehydration ａnd staining on BOND. It is specially
formulated to be compatible with the automated BOND system, and
efficiently removes wax from slides while retaining the integrity of tissue
antigens ａnd probe binding sites. BOND Dewax Solution is less harmful than
alternative deparaffinization solutions such as xylene.
更新時(shí)間：2024/11/12 13:40:42
經(jīng)營許可證號(hào)：滬寶食藥監(jiān)械經(jīng)營許20220040號(hào)
標(biāo)簽：Leica 脫蠟液 BOND Dewax Solution
技術(shù)支持：阿儀網(wǎng)， (滬)-非經(jīng)營性-2022-0060總訪問量：4529108
